Single shear joint for node-to-node connections

ABSTRACT

One aspect is an apparatus including a first node including a first bonding surface and a second node including a second bonding surface. The apparatus includes a feature configured to accept an adhesive and an adhesive channel coupled to the feature configured to accept the adhesive. The apparatus includes a shear joint coupling the first node and the second node, the shear joint configured to receive the adhesive in an adhesive region formed by the first bonding surface and the second bonding surface, the adhesive for coupling the first bonding surface to the second bonding surface through the feature configured to accept the adhesive.

BACKGROUND Field

The present disclosure relates generally to apparatus and techniques inmanufacturing, and more specifically to node-to-node connections thatmay be for use in producing vehicles, boats, aircraft and othermechanical structures.

Background

3-D printing, which may also be referred to as additive manufacturing,is a process used to create 3-D objects. The 3-D objects may be formedusing layers of material based on digital model data of the object. A3-D printer may form the layers of material using the digital model datato print one layer at a time. 3-D printed objects may be almost anyshape or geometry.

A 3-D printer may disseminate a powder layer (e.g., powdered metal) onan operating surface. The powder layer may be approximately 100 micronsthick. The 3-D printer may then bond particular areas of the powderlayer into a layer of the object, e.g., by using a laser to bond thepowder of the powder layer together. The steps may be repeated tosequentially form each layer. Accordingly, the 3-D printed object may bebuilt layer by layer to form the 3-D object.

3-D printed components may be used to produce sub-components for variousdevices or apparatus. The 3-D printed sub-components may need to beattached or connected to other sub-components, including other 3-Dprinted sub-components, extruded sub-components, or still othersub-components.

Nodes may be manufactured using 3-D printing or other manufacturingtechniques. The nodes may need to be attached together to form vehicles,boats, aircraft and other mechanical structures. Accordingly,node-to-node connection techniques may be used to attach nodes together.

SUMMARY

Several aspects of node-to-node single shear connections will bedescribed more fully hereinafter with reference to three-dimensionalprinting techniques.

One aspect is an apparatus including a first node including a firstbonding surface and a second node including a second bonding surface.The apparatus also includes a feature configured to accept an adhesiveand an adhesive channel coupled to the feature configured to accept theadhesive. The apparatus also includes a shear joint coupling the firstnode and the second node. The shear joint is configured to receive theadhesive in an adhesive region formed by the first bonding surface andthe second bonding surface. Additionally, the adhesive couples the firstbonding surface to the second bonding surface through the feature thatis configured to accept the adhesive.

One aspect is a method of manufacturing. The method includes additivelymanufacturing a first node having a first bonding surface and a secondnode having a second bonding surface. The method also includes fixturingthe first node and the second node for adhesive injection. The methodincludes drawing vacuum to evacuate a bonding region. The method alsoincludes injecting adhesive through a feature configured to accept anadhesive to fill a bonding region. The bonding region is formed by abonding surface of the first node and a bonding surface of the secondnode. Additionally, the adhesive couples the first bonding surface tothe second bonding surface.

One aspect is an apparatus including means for additively manufacturinga first node having a first bonding surface and a second node having asecond bonding surface. The apparatus also includes means for fixturingthe first node and the second node for adhesive injection. The apparatusincludes means for drawing vacuum to evacuate an adhesive channel. Theapparatus also includes means for injecting adhesive through a featureconfigured to accept an adhesive to fill a bonding region, the bondingregion formed by a bonding surface of the first node and a bondingsurface of the second node. The adhesive couples the first bondingsurface to the second bonding surface.

It will be understood that other aspects of 3-D printed components andrelated fasteners will become readily apparent to those skilled in theart from the following detailed description, wherein it is shown anddescribed only several embodiments by way of illustration. As will berealized by those skilled in the art, the 3-D printed components andrelated fasteners are capable of other and different embodiments, andits several details are capable of modification in various otherrespects, all without departing from the invention. Accordingly, thedrawings and detailed description are to be regarded as illustrative innature and not as restrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects of 3-D printed components and related fasteners will nowbe presented in the detailed description by way of example, and not byway of limitation, in the accompanying drawings, wherein:

FIGS. 1A-D illustrate an example 3-D printer system during differentstages of operation;

FIG. 2 is a diagram illustrating an example connection feature;

FIG. 3 is a diagram illustrating example features to accept sealants;

FIG. 4 is a flowchart illustrating an example method in accordance withthe systems and methods described herein; and

FIG. 5 is a diagram illustrating an example device in accordance withthe systems and methods described herein.

DETAILED DESCRIPTION

The detailed description set forth below in connection with the appendeddrawings is intended to provide a description of various exemplaryembodiments of 3-D printed components and related fasteners and is notintended to represent the only embodiments in which the invention may bepracticed. The term “exemplary” used throughout this disclosure means“serving as an example, instance, or illustration,” and should notnecessarily be construed as preferred or advantageous over otherembodiments presented in this disclosure. The detailed descriptionincludes specific details for the purpose of providing a thorough andcomplete disclosure that fully conveys the scope of the invention tothose skilled in the art. However, the invention may be practicedwithout these specific details. In some instances, well-known structuresand components may be shown in block diagram form, or omitted entirely,in order to avoid obscuring the various concepts presented throughoutthis disclosure.

The use of 3-D printing in the context of composite tooling providessignificant flexibility for enabling manufacturers of mechanicalstructures and mechanized assemblies to manufacture parts with complexgeometries. For example, 3-D printing techniques provide manufacturerswith the flexibility to design and build parts having intricate internallattice structures and/or profiles that are not possible to manufacturevia traditional manufacturing processes.

FIGS. 1A-D illustrate respective side views of an exemplary 3-D printersystem. In this example, the 3-D printer system is a powder-bed fusion(PBF) system 100. FIGS. 1A-D show PBF system 100 during different stagesof operation. The particular embodiment illustrated in FIGS. 1A-D is oneof many suitable examples of a PBF system employing principles of thisdisclosure. It should also be noted that elements of FIGS. 1A-D and theother figures in this disclosure are not necessarily drawn to scale, butmay be drawn larger or smaller for the purpose of better illustration ofconcepts described herein. PBF system 100 can include a depositor 101that can deposit each layer of metal powder, an energy beam source 103that can generate an energy beam, a deflector 105 that can apply theenergy beam to fuse the powder material, and a build plate 107 that cansupport one or more build pieces, such as build piece 109. PBF system100 can also include a build floor 111 positioned within a powder bedreceptacle. The walls of the powder bed receptacle 112 generally definethe boundaries of the powder bed receptacle, which is sandwiched betweenthe walls 112 from the side and abuts a portion of the build floor 111below. Build floor 111 can progressively lower build plate 107 so thatdepositor 101 can deposit a next layer. The entire mechanism may residein a chamber 113 that can enclose the other components, therebyprotecting the equipment, enabling atmospheric and temperatureregulation and mitigating contamination risks. Depositor 101 can includea hopper 115 that contains a powder 117, such as a metal powder, and aleveler 119 that can level the top of each layer of deposited powder.

Referring specifically to FIG. 1A, this figure shows PBF system 100after a slice of build piece 109 has been fused, but before the nextlayer of powder has been deposited. In fact, FIG. 1A illustrates a timeat which PBF system 100 has already deposited and fused slices inmultiple layers, e.g., 150 layers, to form the current state of buildpiece 109, e.g., formed of 150 slices. The multiple layers alreadydeposited have created a powder bed 121, which includes powder that wasdeposited but not fused.

FIG. 1B shows PBF system 100 at a stage in which build floor 111 canlower by a powder layer thickness 123. The lowering of build floor 111causes build piece 109 and powder bed 121 to drop by powder layerthickness 123, so that the top of the build piece and powder bed arelower than the top of powder bed receptacle wall 112 by an amount equalto the powder layer thickness. In this way, for example, a space with aconsistent thickness equal to powder layer thickness 123 can be createdover the tops of build piece 109 and powder bed 121.

FIG. 1C shows PBF system 100 at a stage in which depositor 101 ispositioned to deposit powder 117 in a space created over the topsurfaces of build piece 109 and powder bed 121 and bounded by powder bedreceptacle walls 112. In this example, depositor 101 progressively movesover the defined space while releasing powder 117 from hopper 115.Leveler 119 can level the released powder to form a powder layer 125that has a thickness substantially equal to the powder layer thickness123 (see FIG. 1B). Thus, the powder in a PBF system can be supported bya powder material support structure, which can include, for example, abuild plate 107, a build floor 111, a build piece 109, walls 112, andthe like. It should be noted that the illustrated thickness of powderlayer 125 (i.e., powder layer thickness 123 (FIG. 1B)) is greater thanan actual thickness used for the example involving 150previously-deposited layers discussed above with reference to FIG. 1A.

FIG. 1D shows PBF system 100 at a stage in which, following thedeposition of powder layer 125 (FIG. 1C), energy beam source 103generates an energy beam 127 and deflector 105 applies the energy beamto fuse the next slice in build piece 109. In various exemplaryembodiments, energy beam source 103 can be an electron beam source, inwhich case energy beam 127 constitutes an electron beam. Deflector 105can include deflection plates that can generate an electric field or amagnetic field that selectively deflects the electron beam to cause theelectron beam to scan across areas designated to be fused. In variousembodiments, energy beam source 103 can be a laser, in which case energybeam 127 is a laser beam. Deflector 105 can include an optical systemthat uses reflection and/or refraction to manipulate the laser beam toscan selected areas to be fused.

In various embodiments, the deflector 105 can include one or moregimbals and actuators that can rotate and/or translate the energy beamsource to position the energy beam. In various embodiments, energy beamsource 103 and/or deflector 105 can modulate the energy beam, e.g., turnthe energy beam on and off as the deflector scans so that the energybeam is applied only in the appropriate areas of the powder layer. Forexample, in various embodiments, the energy beam can be modulated by adigital signal processor (DSP).

FIG. 2 is a diagram illustrating an example connection feature 200. Theexample connection feature 200 may be a node-to-node connection 202. Thenode-to-node connection 202 may be realized by a joint 204 including asingle shear adhesive bond 222. The joint 204 including the single shearadhesive bond 222 may be a joining technique between additivelymanufactured nodes (e.g., first node 206, second node 208). The nodes206, 208 may be fabricated with substantially flat features 210, 212 tofacilitate adhesive bonding therebetween to form the connection (e.g.,the single shear joint 204).

The basic steps to form the joint may be to additively manufacturing thetwo nodes 206, 208 with bonding features 224, 226 (e.g., of bond joint204). Adhesive inlet ports and adhesive outlet ports (not shown) may beon either one or both of the nodes 206, 208. The adhesive and vacuumports may be cylindrical connection points for adhesive and/or vacuumtubes. Adhesive may be injected through the inlet port, and the adhesivemay flow into adhesive regions and flows out of the adhesive outletport. An aspect may rely on the pressure of the adhesive injection. Inanother aspect, the adhesive outlet port may be connected to a vacuumport. The nodes 206, 208 may include sealing features 214. For example,the sealing feature 214 may be in one of the nodes 208.

The basic steps to form the joint may include applying the seals 216(e.g., o-rings or other mechanical seals) to the sealing features 214and fixturing the nodes 206, 208 for adhesive injection. The basic stepsto form the joint may also include drawing a vacuum to evacuate abonding region 218 to obtain a sealed section. Additionally, the basicsteps to form the joint may include injecting adhesive through theadhesive port to fill the bonding region 218. The basic steps to formthe joint may also include letting the adhesive cure to obtain theconnection. The bonding region 218 may be formed by a bonding surface232 of the first node 206 and a bonding surface 234 of the second node208. The adhesive may be used for coupling the first bonding surface 232to the second bonding surface 234.

The example of FIG. 2 illustrates a cross-section of an example joint204 including a single shear adhesive bond 222. In the cross-section,the first node 206 and the second node 208 may include bonding features224, 226 (e.g., of bond joint 204). The bonding features 224, 226 (e.g.,the substantially flat features 210, 212 of the bonding joint 204) maybe parallel to each other. The substantially flat features 210, 212 maybe oriented to the load path by a certain angle to enable initialfitment of the two nodes prior to the application of adhesive. In anaspect, the angle may be 1 degree. In an aspect, the angle may be lessthan 1 degree. In an aspect, the angle may be between 1 and 2 degrees.In an aspect, the angle may be between 2 and 3 degrees. In an aspect,the angle may be between 3 and 4 degrees. In an aspect, the angle may bebetween 5 and 6 degrees. In an aspect, the angle may be between 6 and 7degrees. In an aspect, the angle may be between 7 and 8 degrees. In anaspect, the angle may be between 8 and 9 degrees. In an aspect, theangle may be between 9 and 10 degrees. In an aspect, the angle may bebetween 1 and 10 degrees.

In an aspect, a slight angled (e.g., at angle θ) orientation may bedesigned in such a way that section of the adhesive bond 222 remainssubstantially parallel with the load path 220 to produce a connectionwith suitable mechanical properties.

FIG. 3 is a diagram 300 illustrating examples of features 302, 304configured to accept sealants. The features 302 may be formed by a pairof nodes 306A, 306B. In another aspect, the features 304 configured toaccept sealants may be present on one of the nodes 312B. The features302, in one aspect, may be grooves in which O-Rings may be fitted. TheO-Ring (see example O-ring profile 314) may form a loop around thesurface of the second node 312B, e.g., within the grooves. In an aspect,one O-ring may be bent across four phases or sides of the node. TheO-ring may be configured to form a bridge between two parts of the node.The bridge may allow adhesive to flow from one part of the node toanother part of the node, e.g., between portions of the O-ring. Forexample, portions of the O-ring may seal around a node, while leaving agap between the O-ring portions that may act as a bridge. The region 308bound by the O-Ring may be an adhesive bond region between the two nodes312A, 312B. The seal may provide a hermetically sealed environment(e.g., within an adhesive bond region, such as region 308) for adhesiveto be drawn into to realize the bond. Additionally, the seals (e.g.,adhesive and/or O-ring) may serve as isolators to prevent physicalcontact of the two nodes 306A, 306B or the nodes 312A, 312B beingjoined, thereby reducing or eliminating the possibility of galvaniccorrosion.

A design consideration while designing O-Ring based seals may be toinclude bridging. As adhesive is drawn into the sealed section throughthe adhesive port, the adhesive may fill the sealed section and be drawnby the vacuum (e.g., drawn by a negative pressure source connected to avacuum port). Bridges may ensure that the adhesive completely fills thesealed section (e.g., within an adhesive bond region, such as region308) and the fill process may continue in a smooth, stable manner.

In an aspect, a vacuum port and an adhesive port may be located oneither one of the nodes 306, 312. Additively manufacturing the nodes306, 312 may provide the ability to design ports and internal channelsfor the adhesive and vacuum to be filled (or drawn) through the channelsto first evacuate the sealed chamber, and then to introduce adhesiveinto the chamber. These ports may be referred to as vacuum ports and/orvacuum ports. In some aspects, these vacuum ports and/or vacuum portsmay be protrusions or recesses. Adhesive may be injected through theinlet port, and the adhesive may flow into adhesive regions and flowsout of the adhesive outlet port. An aspect may rely on the pressure ofthe adhesive injection. In another aspect, the adhesive outlet port maybe connected to a vacuum port.

FIG. 4 is a flowchart illustrating an example method in accordance withthe systems and methods described herein. At 402, an apparatusimplementing the method may manufacture a first node. The first node mayhave a first bonding surface. For example, an apparatus implementing themethod may additively manufacture the first node 206. The first node 206may have a first bonding surface 232. In an aspect, the apparatus 500discussed with respect to FIG. 5, below, may be configured to cause thePBF system 100 discussed with respect to FIGS. 1A-1D to additivelymanufacture a first node 206 having a first bonding surface 232.

At 404, an apparatus implementing the method may manufacture a secondnode having a second bonding surface. For example, an apparatusimplementing the method may additively manufacture the second node 208having the second bonding surface 234. In an aspect, the apparatus 500discussed with respect to FIG. 5 may be configured to cause the PBFsystem 100 discussed with respect to FIGS. 1A-1D to additivelymanufacture a second node 208 having a second bonding surface 234.

At 406, an apparatus implementing the method may fixture the first nodeand the second node for adhesive injection. For example, an apparatusimplementing the method may fixture the first node 206 for adhesiveinjection. The apparatus implementing the method may also fixture thesecond node 208 for adhesive injection. In an aspect, the assemblyapparatus 500 discussed with respect to FIG. 5 may be configured tocause an assembly apparatus to fixture the first node 206 and the secondnode 208 for adhesive injection.

At 408, an apparatus implementing the method may apply at least oneseal. For example, an apparatus implementing the method may apply aplurality of seals. In an aspect, the apparatus 500 discussed withrespect to FIG. 5 may be configured to cause an assembly apparatus toapply at least one seal.

At 410, an apparatus implementing the method may draw a vacuum toevacuate an adhesive channel. For example, an apparatus implementing themethod may be connected to vacuum lines and may draw a vacuum toevacuate an adhesive channel. In an aspect, the apparatus 500 discussedwith respect to FIG. 5 may be configured to cause an assembly apparatusto draw vacuum to evacuate an adhesive channel. For example, theapparatus 500 discussed with respect to FIG. 5 may cause a vacuum pumpwithin an assembly apparatus to draw vacuum to evacuate an adhesivechannel in a node being manufactured.

At 412, an apparatus implementing the method may inject adhesive througha feature configured to accept an adhesive to fill a bonding region. Thebonding region may be formed by a bonding surface of the first node anda bonding surface of the second node. The adhesive may be used forcoupling the first bonding surface to the second bonding surface. Forexample, the apparatus 500 discussed with respect to FIG. 5 may beconfigured to cause an assembly apparatus to inject adhesive through afeature configured to accept an adhesive to fill an bonding region 218.The bonding region 218 may be formed by a bonding surface 228 of thefirst node 206 and a bonding surface 230 of the second node 208. Theadhesive may be used for coupling the first bonding surface 232 to thesecond bonding surface 232.

At 414, an apparatus implementing the method may let the adhesive cure.For example, an apparatus implementing the method may pause themanufacturing process or pause the manufacturing process with respect toa component to be cured to let the adhesive cure. In an aspect, theapparatus 500 discussed with respect to FIG. 5 may be configured tocause an assembly apparatus to let the adhesive cure. For example, theapparatus 500 may pause the manufacturing process or pause themanufacturing process with respect to a component to be cured to let theadhesive cure.

The assembly apparatus may be one or more assembly apparatus configuredto perform one or more of 506, 508, 510, 512, and/or 514.

FIG. 5 is a diagram illustrating an apparatus 500 that may be configuredto implement the systems and methods described herein, e.g., the methodimplemented in FIG. 4. For example, the apparatus 500 may be a processor512 based control system that may control the PBF system 100 discussedwith respect to FIGS. 1A-1D. The apparatus 500 may include functionalblocks that can represent functions implemented by a processor,software, hardware, or a combination thereof (e.g., firmware).

As illustrated, in FIG. 5, (and referring back to FIG. 2) in an aspect,the apparatus 500 may include a component 502 that controls theadditively manufacture of a first node having a first bonding surface232. For example, the component 502 may control the PBF system 100discussed with respect to FIGS. 1A-1D. In an aspect, the apparatus 500may include a component 504 that controls the additively manufacture ofa second node 208 having a second bonding surface. For example, thecomponent 504 may control the PBF system 100 discussed with respect toFIGS. 1A-1D. The components 502 and 504 may be separate components 502,504 that may control one or more PBF systems 100. For example, twoseparate components 502, 504 may generally be used to control two PBFsystems 100, i.e., one component 502, 504 for each PBF system 100. Thecomponents 502 and 504 may be a single component 520 that may controlone or more PBF systems 100. For example, a single component 520 maygenerally be used to control a single PBF system, i.e., one component520 for the PBF system 100.

The apparatus 500 may include a component 506 that controls thefixturing of the first node 206 and the second node 208 for adhesiveinjection. For example, the component 506 may control the PBF system 100discussed with respect to FIGS. 1A-1D to control fixturing. Theapparatus 500 may include a component 508 that controls the draw of avacuum to evacuate an adhesive channel control. For example, thecomponent 506 may control the PBF system 100 discussed with respect toFIGS. 1A-1D to control drawing a vacuum. The apparatus 500 may include acomponent 510 that controls the injecting of adhesive through a featureconfigured to accept an adhesive control. For example, the component 510may control the PBF system 100 discussed with respect to FIGS. 1A-1D tocontrol the injecting. The apparatus 500 may include a component (e.g.,processor 512) that controls applying at least one seal. For example,the component (e.g., processor 512) may control the PBF system 100discussed with respect to FIGS. 1A-1D to control applying at least oneseal. The apparatus 500 may include a component 514 that controlsletting the adhesive cure. For example, the component 514 may controlthe PBF system 100 discussed with respect to FIGS. 1A-1D to controlcuring.

In related aspects, the apparatus 500 may optionally include a processorcomponent having at least one processor 516. The processor 516 may be inoperative communication with the components 502, 504, 506, 508, 510,512, 514, 520 or similar components via a bus 522 or similarcommunication coupling. The processor 516 may effect initiation andscheduling of the processes or functions performed by components 502,504, 506, 508, 510, 512, 514, 520. The processor 516 may encompass thecomponents 502, 504, 506, 508, 510, 512, 514, 520, in whole or in part.In the alternative, the processor 516 may be separate from thecomponents 502, 504, 506, 508, 510, 512, 514, 518, 520, which mayinclude one or more separate processors.

The apparatus 500 may optionally include a component for storinginformation, such as, for example, a memory device/component 518. Thecomputer readable medium or the memory component 518 may be operativelycoupled to the other components of the apparatus 500 via the bus 522 orthe like. The memory component 518 may be adapted to store computerreadable instructions and data for performing the activity of thecomponents 502, 504, 506, 508, 510, 512, 514, 520, and subcomponentsthereof, or the processor 516, or the methods disclosed herein. Thememory component 518 may retain instructions for executing functionsassociated with the components 502, 504, 506, 508, 510, 512, 514, 520.While shown as being external to the memory component 518, it is to beunderstood that the components 502, 504, 506, 508, 510, 512, 514, 520can exist within the memory component 518.

The means for additively manufacturing a first node 206 may have a firstbonding surface 232 and the means for additively manufacturing a secondnode 208 having a second bonding surface may be one or more of the PBFsystem 100 discussed with respect to FIGS. 1A-1D. The means forfixturing the first node 206 and the second node 208 for adhesiveinjection may include a fixture configured to hold the first node 206and the second node 208. The means for drawing a vacuum to evacuate anadhesive channel may include a vacuum pump or other pump capable ofdrawing a vacuum. The means for injecting adhesive through a featureconfigured to accept an adhesive to fill a bonding region may be aninjection pump or some other type of pump capable of injecting adhesive.In an aspect, one or more of the means for fixturing, the means fordrawing a vacuum, or the means for injecting adhesive may beincorporated into the PBF system 100 with the means for additivelymanufacturing a first node 206 having a first bonding surface 232 andthe means for additively manufacturing a second node 208 having a secondbonding surface.

In accordance with various aspects of the disclosure, an element, or anyportion of an element, or any combination of elements may be implementedwith a “processing system” that includes one or more processors.Examples of processors include microprocessors, microcontrollers,digital signal processors (DSPs), field programmable gate arrays(FPGAs), programmable logic devices (PLDs), state machines, gated logic,discrete hardware circuits, such as a custom application-specificintegrated circuit (ASIC), and other suitable hardware configured toperform the various functionality described throughout this disclosure.One or more processors in the processing system may execute software.Software shall be construed broadly to mean instructions, instructionsets, code, code segments, program code, programs, subprograms, softwaremodules, applications, software applications, software packages,routines, subroutines, objects, executables, threads of execution,procedures, functions, etc., whether referred to as software, firmware,middleware, microcode, hardware description language, or otherwise. Thesoftware may reside on a computer-readable medium. The computer-readablemedium may be a non-transitory computer-readable medium. Anon-transitory computer-readable medium includes, by way of example, amagnetic storage device (e.g., hard disk, floppy disk, magnetic strip),an optical disk (e.g., compact disk (CD), digital versatile disk (DVD)),a smart card, a flash memory device (e.g., card, stick, key drive),random access memory (RAM), read only memory (ROM), programmable ROM(PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), aregister, a removable disk, and any other suitable medium for storingsoftware and/or instructions that may be accessed and read by acomputer. The computer-readable medium may also include, by way ofexample, a carrier wave, a transmission line, and any other suitablemedium for transmitting software and/or instructions that may beaccessed and read by a computer. The computer-readable medium may beresident in the processing system, external to the processing system, ordistributed across multiple entities including the processing system.The computer-readable medium may be implemented in a computer-programproduct. By way of example, a computer-program product may include acomputer-readable medium in packaging materials. Those skilled in theart will recognize how best to implement the described functionalitypresented throughout this disclosure depending on the particularapplication and the overall design constraints imposed on the overallsystem.

It is to be understood that the specific order or hierarchy of steps inthe methods disclosed is for purpose of example, and not for limitation.Based upon design preferences, it is understood that the specific orderor hierarchy of steps in the methods may be rearranged. The accompanyingmethod claims present elements of the various steps in a sample order,and are not meant to be limited to the specific order or hierarchypresented unless specifically recited therein.

The previous description is provided to enable any person skilled in theart to practice the various aspects described herein. Variousmodifications to these aspects will be readily apparent to those skilledin the art, and the generic principles defined herein may be applied toother aspects. Thus, the claims are not intended to be limited to theaspects shown herein, but is to be accorded the full scope consistentwith the language of the claims, wherein reference to an element in thesingular is not intended to mean “one and only one” unless specificallyso stated, but rather “one or more.” Unless specifically statedotherwise, the term “some” refers to one or more. A phrase referring to“at least one of” a list of items refers to any combination of thoseitems, including single members. As an example, “at least one of: a, b,or c” is intended to cover: a; b; c; a and b; a and c; b and c; and a, band c. All structural and functional equivalents to the elements of thevarious aspects described throughout this disclosure that are known orlater come to be known to those of ordinary skill in the art areexpressly incorporated herein by reference and are intended to beencompassed by the claims. Moreover, nothing disclosed herein isintended to be dedicated to the public regardless of whether suchdisclosure is explicitly recited in the claims. No claim element is tobe construed under the provisions of 35 U.S.C. § 112, sixth paragraph,unless the element is expressly recited using the phrase “means for” or,in the case of a method claim, the element is recited using the phrase“step for.”

What is claimed is:
 1. A joint, comprising: a first node including afirst bonding surface; a second node including a second bonding surface;an adhesive channel within at least one of the first node or the secondnode and configured to accept an adhesive in an adhesive region formedby the first bonding surface and the second bonding surface, theadhesive for coupling the first bonding surface to the second bondingsurface, wherein the first bonding surface and the second bondingsurface are substantially flat; grooves formed in at least one of thefirst or second nodes along opposite edges of the adhesive region; andat least one O-ring fitted in the grooves to seal the edges of theadhesive region and to prevent physical contact between the firstbonding surface and the second bonding surface, wherein the at least oneO-ring seal is further configured to form two loops bounding differentportions of the adhesive region and a bridge between the two loops torestrict flow of the adhesive to within the bridge.
 2. The joint ofclaim 1, further comprising an adhesive inlet and an adhesive outlet onthe at least one of the first node or the second node and including theadhesive channel.
 3. The joint of claim 2, wherein the adhesive inletcomprises an adhesive port and the adhesive outlet comprises a vacuumport.
 4. The joint of claim 3, wherein each of the adhesive port and thevacuum port comprise at least one of a protrusion or a recess.
 5. Thejoint of claim 1, wherein the at least one O-ring is bent across foursides of the second node.
 6. The joint of claim 5, wherein one portionof the groove is formed within the first node and another portion of thegroove is formed within the second node.
 7. The joint of claim 1,wherein the at least one O-ring provides a hermetically sealedenvironment for the adhesive.
 8. The joint of claim 1, wherein the firstbonding surface and the second bonding surface are parallel to eachother.
 9. The joint of claim 1, wherein the first bonding surface andthe second bonding surface are oriented to a load path by an angle. 10.The joint of claim 9, wherein a section of the adhesive in the adhesiveregion remains substantially parallel with the load path.